How to Build a Better Chiplet Packaging to Extend Moore’s Law

Packaging approaches like chiplet tech can extend Moore’s Law. But what does that mean for chip design product developers and fabs?
By John Blyler – Moore’s Law may not be dead, but it certainly has been challenged significantly beyond the 28nm process node. Fortunately, there are ways to extend Moore’s Law’s cost, feature, and size benefits. One way is to use chiplets – or modular dies – that effectively bypass Moore’s Law by replacing single silicon die with multiple smaller dies that work together in a unified packaged solution.

This approach provides much more silicon to add transistors compared to a monolithic microchip. As a result, chiplets are expected to return to the two-year doubling cycle that has been the cornerstone economics of the semiconductor business since 1965.

The global market for processor microchips that utilize chiplets in their manufacturing process is set to expand to $5.8 billion in 2024, rising by a factor of nine from $645 million in 2018, according to Omdia(Image Source: IEDM 2017, AMD Dr. Lisa Su keynote) more>

READ  A Battle Plan for Mexico's U.S. Trade War

Leave a Reply

Your email address will not be published. Required fields are marked *