Packaging approaches like chiplet tech can extend Moore’s Law. But what does that mean for chip design product developers and fabs?
By John Blyler – Moore’s Law may not be dead, but it certainly has been challenged significantly beyond the 28nm process node. Fortunately, there are ways to extend Moore’s Law’s cost, feature, and size benefits. One way is to use chiplets – or modular dies – that effectively bypass Moore’s Law by replacing single silicon die with multiple smaller dies that work together in a unified packaged solution.
This approach provides much more silicon to add transistors compared to a monolithic microchip. As a result, chiplets are expected to return to the two-year doubling cycle that has been the cornerstone economics of the semiconductor business since 1965.
The global market for processor microchips that utilize chiplets in their manufacturing process is set to expand to $5.8 billion in 2024, rising by a factor of nine from $645 million in 2018, according to Omdia. (Image Source: IEDM 2017, AMD Dr. Lisa Su keynote) more>
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By Bill Martin – In this period, Moore’s Law was ‘coined’ and quickly drove and guided silicon manufacturers to prove their processing prowess. It also drove product companies and their marketing staffs to harness the guaranteed 2x density, improved performance and less expensive next generation silicon technology within their products. Like an atomic clock, the market expected and received the new capabilities every 18-24 months.
The IC treadmill was at full speed replacing older, larger, slower, higher maintenance products with ICs. As ‘they’ conquered existing products, new uses from the significant (medical devices), to the trivial (musical greeting cards) were developed to capture the growing disposable income. In the early days, it was cheap to create any type of product to test market acceptance. more> http://tinyurl.com/km2s5uf
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By Rick Merritt – In the midst of all the changes, old age caught up with Moore’s Law. The new 28-nm node came on too slowly to serve the needs of all the mobile systems clamoring for low power chips.
Blame the lack of new lithography. Extreme ultraviolet (EUV) continued to miss schedules, slipping perhaps beyond usefulness even in the 10 nm node.
- A down year
- The shift to the mobile cloud
- The rise of the mega data center
- Moore’s Law slows
- The winners: ARM
- MIPS on the ropes
- More winners: Apple, Samsung, Qualcomm
- Roads diverge for Wintel
- The Losers: Elpida, Nokia, AMD, Renesas, STM, TI
- The next big thing in networking: SDN
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Tagged ARM architecture, Business, Elpida, Moore's law, Nokia, Renesas Electronics, Samsung, Super regions, United States