To create parts made of metal in electronic devices, engineers have traditionally used heat, as metals must be molten to be formed. Researchers now have devised a way that eliminates the need for heat when creating electronic interconnects, facilitating the design of flexible and wearable electronics, they said.
A team at the designed the method, which pre-heats metal—in this case, an alloy of bismuth, indium, and tin–and keeps it as a liquid, creating conductive interfaces without damaging the substrate, explained University of Iowa Professor Martin Thuo, who led the research team.
One of the two money-raising deals, announced this week, sees it selling its industrial warehouses to Blackstone group for $5.9 billion. This deal includes 465 light industrial buildings in 26 US markets, mainly aimed at last-mile logistics companies.
Researchers at L’Ecole Polytechnique Fédérale de Lausanne (EPFL) have developed biodegradable micro-resonators that they can heat locally and remotely with a wireless system that can be built into implants to release painkillers within human tissue, eliminating the need for invasive procedures like injections or catheters to deliver medication. The devices also could help prevent any ill effects of medications from affecting other parts of the body, researchers said.
Specifically, a team in EPFL’s Microsystems Laboratory at the School of Engineering developed a micro-sized electronic circuit–a resonant circuit in the shape of a small spiral–that is made from magnesium, a biocompatible material already found in the human body.
The Space and Missile Systems Center (SMC), in partnership with the National Reconnaissance Office (NRO), awarded a sole source, five-year, $1.18 billion Firm-Fixed-Price (FFP) modification of the Delta IV Heavy contract, saving $455 million.
This modification was awarded to United Launch Alliance (ULA) for Launch Operations Support (LOPS), in support of five NRO Launch (NROL) missions: NROL-44, NROL-82, NROL-91, NROL-68, and NROL-70.
To meet required launch dates while maintaining the best value for the Government, SMC and NRO divided this contract into a Launch Vehicle Production Services (LVPS) component and a LOPS component.
Mavenir has gone Scandi in its efforts to plug an important hole in its virtualization portfolio, today opening a new research facility in Stockholm that will specialize in radio access networks (RAN).
It’s the US software company’s first “center of innovation” dedicated to RAN technology, and Mavenir figured there was no better place for RAN expertise than the Swedish capital, where Ericsson engineers are a regular feature of the landscape.
The company says no, but it has been active in acquiring several vendors that solve specific carrier problems that stem from having an outdated back office.
Ciena announced on Thursday that it would acquire privately held Centina for an undisclosed sum. Plano, Texas-based Centina provides software to help carriers by giving them the analytics necessary to provide service assurance and monitor their networks. The acquisition will close by the end of this year.
“This looks like a nice tuck-in for Ciena and a good exit for Centina as they were a small player in a competitive field (service assurance) that is increasingly being morphed into closed-loop, self-healing orchestration platforms (like ONAP) rather than a clearly separate category,” said James Crawshaw, a senior analyst at Heavy Reading, in an email exchange with Light Reading.
Avaya has entered into a strategic partnership with RingCentral on a new cloud offering worth at least $500 million.
Through the exclusive partnership, Avaya will introduce Avaya Cloud Office by RingCentral (Avaya Cloud Office), a new global unified communications as-a-service (UCaaS) solution.
Avaya Cloud Office, due for launch Q1 2020, expands the company’s existing portfolio to offer a full suite of UC, CC, UCaaS and CCaaS solutions to a global customer base, which includes more than 120,000 customers, over 100 million UC lines and 5 million CC users in over 180 countries.
Smart manufacturing uses a number of technologies, including digitalization, internet of things (IoT), big data, and robotics. To increase information visibility and system control in manufacturing systems, manufacturers are deploying advanced sensors and control systems with artificial intelligence (AI) algorithms.
The global market for smart manufacturing is forecast to reach $370 billion in 2022, growing at a compound annual growth rate of 10.7%, according to TrendForce. What makes this market so large are the use cases. Smart manufacturing encompasses a variety of applications that include smart factories, smart supply chains, automated delivery vehicles, and robotic arms.
The global number of AI edge devices is forecast to jump from 161.4 million units in 2018 to 2.6 billion units by 2025, according to Tractica LLC. The top AI-enabled edge devices include mobile phones, smart speakers, PCs/tablets, head-mounted displays, automotive, drones, robots, and security cameras.
The annual MEMS & Imaging Sensors Summit in Grenoble, organized by SEMI, is a premiere place to discover what the established large players and emerging startups are developing to bring us ubiquitous sensing.
EE Times correspondents have been regular attendees at the conference, and we were back this year for a packed two-track conference covering MEMS and imaging sensors.