Natural-language processing (NLP) is a particularly difficult task for AI. Complex language such as idioms and sentiment shifters, wherein combinations of words change the meaning of phrases, have made it much harder for machines to understand casual speech. These parts of everyday speech have traditionally been very difficult for machines to spot, but understanding the nuance they add to language is vital to successful NLP.
The new frontier of leading-edge IC design is packaging, according to Arijit Raychowdhury, an expert in digital and mixed-signal design who teaches VLSI courses at the Georgia Institute of Technology and who received the 2018 IEEE/ACM “Innovator Under 40 Award” at that year’s Design Automation Conference.
Integration is the holy grail of VLSI design. Next-generation IC design lives or dies on the next feasible advance in integration. Historically, the VLSI community has depended on progress in process node technology to overcome the next fast-approaching bump on the road toward higher integration. But times are changing.
Market forces behind battery EVs (BEV) and internal combustion engine vehicles (ICEV) are rapidly changing.
There are two approaches to electric vehicles — BEVs and PHEVs. In BEVs the propulsion system is based on batteries only. The plug-in hybrid electric vehicle (PHEV) use both batteries and an internal combustion engine. This column is focused on BEVs, because it is the long-term winner. Medium and heavy truck segments are also starting to use batteries or fuel-cells, but are not included in this analysis.
When the mobile communications industry started its long evolution to the 5th generation (5G), one of the early significant applications identified was broadcasting. 5G was seen as equally applicable for both delivery of content and its production, notably for outside broadcast but also in a studio. However, this low hanging fruit has yet to start ripening in any serious way.
“There are some deployments we can point to, but on the whole what we are seeing are complementary applications rather than 5G being ready for any meaningful distribution of media content,” Peter MacAvock, Head of Delivery, Platforms and Services at the European Broadcasting Union’s Technology and Innovation Division told EE Times.
Clearly, data centers will not be able to meet their increasing performance demands by simply scaling up existing processors without increasing their power consumption even faster. As the industry moves toward more modern services based on containers and microservices, which are meant to help applications rapidly scale up and down based on demand, performance and power efficiency will be absolutely critical and will require new cloud-native server processors built specifically to handle these innovative cloud workloads.
At this year’s 2020 Symposia on VLSI Technology and Circuits, under the theme of “The Next 40 Years of VLSI for Ubiquitous Intelligence”, a number of talks focused on developing advanced circuit design and application platforms to enable such ubiquitous intelligence. IBM Research and CEA-Leti showed their work on nanosheet architectures to drive the silicon performance needs of such applications.
A team from IBM Research presented its work on a new nanosheet architecture that successfully creates pockets of air, called air spacers, around a transistor gate, which work universally on any device architecture and provide a more practical, compatible way to enable devices to consume less power and perform better. In fact, they have shown that applying this air spacer on a 7 nm node device delivers better performance gains and power reduction than scaling the device to 5 nm node.
A group of U.S. senators last week proposed yet another bill to revive the domestic chip industry, the American Foundries Act of 2020 (AFA).
This new bipartisan proposal is the second such measure in a month, following the Creating Helpful Incentives to Produce Semiconductors (CHIPS) act, introduced on June 10.
The two initiatives highlight the effort by the U.S. government to localize the electronics supply chain and rebuild the domestic semiconductor industry now that most of the world’s production has shifted to Asia.